Loctite 3609 Epoxy Gel for Pre-Wave Soldering low temperature cure Solvent-Free One-Component

Solvent-Free One-Component

and only auxiliary curing methods can be relied on

•         Universal Activator: Match with LOCTITE 7120

leading to incomplete curing and bonding failure

Loctite 3609 Epoxy Gel for Pre-Wave Soldering low temperature cure Solvent-Free One-ComponentAdhesive epoxy gel for bonding surface mount components to printed circuit boards prior to wave soldering LOCTITE 3609 is a dark red tacky epoxy gel suitable for bonding surface mount components to printed circuit boards prior to wave soldering. It is particularly suitable for applications requiring medium to high dispensing speeds, high precision dispensing specifications, high wet strength and good electrical properties.